EMI Testing Capability
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THE FOLLOWING WIDE RANGE OF EMISSION AND IMMUNITY/SUSCEPTIBILITY TESTS
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Testing to the European EMC Directive
89/336/EEC, Automotive Directive 95/54/EEC, Medical Device Directive
(MDD) 93/42/EEC, to enable a manufacture to make a declaration of
conformity and to affix the CE mark. |
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Emission Testing to EN55022/EN55011
Class A or B and EN 61000-3-2 and immunity testing to EN50082-1/2,
EN55024, EN61000-6-2, using the IEC 1000-4-2, IEC 1000-4-3, IEC
1000-4-4, IEC 1000-4-6 test methods. |
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Electromagnetic compatibility testing
for fire, intruder and social alarm systems in EN50130-4 |
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Electromagnetic compatibility testing
for lab equipment in EN 61326 |
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Electromagnetic compatibility testing for
radio equipment in EN 301 489-x |
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Electromagnetic compatibility testing
for rolling stock in EN 50121-4-8 |
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Electromagnetic compatibility testing
for medical electrical equipment contained in IEC 601-1-2. |
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Emission testing to CISPR-11 and
CISPR-22, Class A and B. |
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FCC CFR 47 Part 15 Class A and Class B
emission testing for certification or verification. |
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Testing on wireless products to ensure
compliance with the maximum exposure (MPE) limits in CFR 47 part 1. |
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The open area test site NSA test and the
test data, as well as the conducted emission test site in the
anechoic chamber have been reviewed by the FCC and have been found
to be compliance with the requirements of Section 2.948 of the FCC
rules. |
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MIL-STD 461 emission and susceptibility EMI testing in compliance
with MIL-STD-462 test procedures. |
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RTCA DO-160C/D emission and
susceptibility EMI testing on airborne
equipment. |
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MIL-STD-220 filter attenuation tests
10kHz to 10GHz. |
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MIL-STD-285 shielded room attenuation
testing from 10kHz to 10GHz. |
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Cable transfer impedance testing. |
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Equipment enclosure electric field/
magnetic field/plane wave attenuation testing. |
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PCB, equipment enclosure and cable probing using near field magnetic and electric field probes and current probe for both emissions and immunity. Using a 3mm probe PCB, emission sources can be isolated to IC pins and traces. |